New insider information confirms a major AMD Zen 6 RDNA 5 leak, revealing early details about the upcoming “Medusa” architecture. AMD is currently developing two major CPU platforms — Zen 5 and Zen 6 — with significant performance and packaging upgrades expected.AMD is currently developing two major architectures: Zen 5, codenamed Nirvana, and Zen 6, known as Morpheus. These next-generation processors are expected to deliver a significant upgrade to the Zen platform in terms of performance and chip packaging technologies.
Zen 5 will arrive this year inside Granite Ridge and Strix Point processors. According to leaks, Granite Ridge models will feature RDNA 2 integrated graphics, similar to Raphael chips. Meanwhile, Strix Point is expected to receive a much more powerful integrated GPU based on Navi 3.5 (RDNA 3.5).
According to the AMD Zen 6 RDNA 5 leak, the company may adopt 2.5D packaging. Based on insider information, the next consumer architecture – Zen 6, internally called Medusa, may introduce a major shift for AMD. Rumors suggest that the company plans to replace traditional multi-chip layouts with 2.5D interconnect technology, allowing significantly increased bandwidth between chiplets within the processor.
Additionally, insider Everest (@Olrak29_) claims that RDNA 5 graphics will be used in Zen 6 consumer CPUs, meaning AMD may skip RDNA 4 for this product generation entirely.
Little is currently known about RDNA 5 (Navi 5), but confidential Microsoft documentation lists it as a potential candidate for next-generation console GPUs.
If the AMD Zen 6 RDNA 5 leak is accurate, the next-gen CPUs could skip RDNA 4 entirely. Rumors also indicate that AMD Zen 6 could be built on a smaller node – possibly a combination of 3 nm and 2 nm technologies – with release expected no earlier than 2025–2026.
Additional insights
The shift toward RDNA 5 graphics marks a strategic evolution in AMD’s long-term roadmap. If Zen 6 truly integrates RDNA 5 instead of RDNA 4, this would align desktop processors with future console-grade technologies listed in confidential Microsoft documents. Analysts believe this change could significantly increase iGPU performance in standard consumer CPUs.
AMD’s move toward 3 nm and even early 2 nm technology nodes will also position Zen 6 competitively against Intel’s upcoming Lion Cove and Panther Cove designs. Combining advanced packaging, RDNA 5 graphics, and new power-efficiency improvements may give Zen 6 a notable advantage in multi-chip communication and sustained workloads.
Read more: AMD RDNA 3 architecture overview
Source: https://www.amd.com/en/technologies/rdna
